Bates Research and Engineering Center

BGA packaging of APV25 chip

Title:

BGA packaging of APV25 chip

Publication Type:

Conference Proceedings

Journal:

10th RD51 Collaboration Meeting, Stonybrook University, NY, October 2 (2012)

Year of Publication:

2012

Authors:

B. Buck

Date Published:

10/2012

Publication Language:

eng

Citation Key:

273

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